Case = 4 bay ATX midi tower
CPU = AMD Duron 1200
FSB = set to 100
Motherboard = Elite K7S5A
Memory = 256 RAM (1 * pc100 & 1 *pc133)
PSU = 300w
HD = WD 20 gb 7200rpm
ROM = HP 8200s
Ambient room temp = avg 26C (Summer)
In idle the BIOS shows the system running at 36C
& the CPU at 49C.
1. I have confirmed AMD chips run hot in comparison to Intel and this particular one has a burnout temperature approx 90C.
2. I intend to use this box as a test server (cross cable connection between a single client and itself), for short periods (less than 8 hours) on any given day... workload would be relatively light as I intend to use it to learn Oracle only.
The motherboard sink is attached by a thermal pad... is there likely to be much benefit in heat dissipation if I remove the pad and reattach the sink with "thermal epoxy"?
Will the current spec operate safely heat wise with or without modification? Please support conclusions (case fans or CPU sink/fan or left as is) with analysis.
Alternatively (as this CPU/MB components are cheap), I'd like your opinion on whether the better option would be to toss the current mb & cpu & install a Celeron (1.7ghz) and a reasonable mb to support it. Advise reasoning supporting this (including whether 300 watt PSU is sufficient), and provide suggestion on what reliable basic mb's supporting Celeron 1.7ghz are worth looking at.