Storage conditions (temperature and humidity) for Printed-Circuit-Board-Assembly (PCBA)
Posted on 2006-07-13
Would like to know storage conditions (temperature and humidity) for PCBA (especially with BGA and mirco BGA chips mounted on it by reflow-soldering). I already searched thru JEDEC for answers but they have recommendation only for solid states device BEFORE reflow-soldering.
More background - our factory manufactures VGA card with SMT process (Screen-Printing - Pick-N-Place - Reflow-soldering). Recently we had VGA cards returned from our end-customer with failure symptom of no boot-up. We can fix these returned VGA cards by just baking them with 125C@6 hrs - then it will boot-up and function ok. It seems that there is moisture coming inside the VGA cards and caused problem. We would like to close this case by recommending storage condition (temperature and humidity range) for our end-customers - it will be better if the recommended storage condition is supported by common industrial standard but I just can't find it.